KARVIINTERCONNECTS

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  ATE Board Design

  We provide specialized ATE (Automatic Test Equipment) PCB design services tailored for high-speed, high-reliability testing environments.
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  Analysis(SI/PI/Tharmal/EMI/EMC)

  We offer advanced design analysis services to ensure your PCB performs flawlessly under real-world conditions. By integrating Power, Signal, Thermal, and EMI analysis
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  Library Services

  We deliver comprehensive solutions for the creation and maintenance of libraries that not only meet IPC 7351B Standards but also align with the unique specifications of our clients
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  Mechanical Engineering

  We go beyond circuitry. Our Mechanical Engineering Services ensure your designs are mechanically sound, thermally efficient, and manufacturable — with seamless integration into enclosures, housings, and real-world environments
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  High-Speed Board Design

  We specialize in High-Speed PCB Design for complex, high-performance systems where signal integrity, timing, and layout precision are critical
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  Embedded HW Engineering

  We provide end-to-end Embedded Hardware Engineering solutions that bring embedded systems to life — from architecture design and component selection to fully tested hardware ready for production
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  Embedded SW Engineering Services

  We offer full-stack Embedded Software Engineering Services — from low-level firmware to real-time operating systems (RTOS) and application layer development
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  PCB FAB

  We support you throughout the entire journey, including working directly with your preferred PCB fabrication and assembly vendors
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  PCB Assembly

  We actively support our customers through the entire PCB Assembly (PCBA) process, working directly with your chosen assembly vendors to ensure smooth production, functional quality, and timely delivery
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  CAM Validation

  we offer expert CAM (Computer-Aided Manufacturing) validation services to ensure your PCB designs are error-free, production-ready, and fully aligned with your fabrication vendor's capabilities
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  Testing

  we work closely with your chosen test or EMS vendor to ensure that your PCBs are thoroughly tested, validated, and meet performance expectations
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  FCP(Flip Chip Package)

  Flip Chip Packaging (FCP) is an advanced packaging technology where the semiconductor die is mounted face-down (flipped) directly onto the substrate using solder bumps
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  SIP(System In Package)

  System-in-Package (SiP) combines multiple semiconductor dies, passive components, and sometimes sensors or MEMS, all within a single package
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  WBD(Wire Bond Design)

  Wire bonding is a crucial process that connects the bond pads of a semiconductor die to the substrate or lead frame using fine wires (gold, aluminum, or copper)
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  MCMC(Multichip Design)

  Multi-Chip Module (MCM) design integrates multiple ICs within a single package or substrate, allowing them to operate together as a unified system
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  CSP(Chip Scale Package)

  Chip Scale Packaging (CSP) is an advanced semiconductor packaging approach where the final package is only slightly larger than the die itself — typically within 20% of the die footprint