KARVIINTERCONNECTS

Miniaturization Without Compromise

Chip Scale Packaging (CSP) is an advanced semiconductor packaging approach where the final package is only slightly larger than the die itself — typically within 20% of the die footprint. CSP enables ultra-small form factors with excellent electrical, thermal, and mechanical performance, ideal for high-density electronic designs.

Package Design & Substrate Layout

• High-density BGA or LGA layout planning
• Redistribution Layer (RDL) design for pad re-mapping
• Organic or ceramic substrates for CSP performance
• Fine-pitch solder ball array and pad design

Electrical & Thermal Optimization

• Impedance-controlled signal routing
• Thermal optimization through material and layout
• Stable Power Delivery Network (PDN) for high-reliability systems

Manufacturability & Testing Support

• CSP-specific DFM guidelines and design checks
• Collaboration with OSATs for fabrication and assembly compatibility
• Test pad/probe access design for quality and validation

Applications Supported

• Mobile phones and wearable devices
• High-speed communication ICs
• Consumer electronics and IoT modules
• Medical implants and miniaturized electronics
• Automotive sensors and electronics