KARVIINTERCONNECTS

Miniaturized Systems. Maximized Performance.

System-in-Package (SiP) combines multiple semiconductor dies, passive components, and sometimes sensors or MEMS, all within a single package. Unlike multi-chip modules (MCMs), SiP focuses on tightly integrated, heterogeneous functions — analog, digital, RF, and power — providing a compact, multifunctional system in one package.

Multi-Die Integration

• Integration of mixed technology dies (logic, memory, RF, power)
• Die stacking, side-by-side placement, and 3D SiP architectures
• Interconnect design with TSVs and redistribution layers (RDL)

Package & Substrate Design

• Design of organic substrates, interposers, and ceramic packages
• Signal routing, power distribution, and ground plane layout
• Thermal management using heat spreaders and thermal vias

Electrical & Thermal Analysis

• Signal integrity, power integrity, and crosstalk mitigation
• Thermal simulations to identify hotspots and optimize cooling
• Stress and warpage analysis to ensure mechanical reliability

Co-Design & Prototyping

• Integration with IC, PCB, and system-level design workflows
• Coordination with foundries, OSATs, and EMS vendors
• Rapid prototyping and design validation support

Applications We Serve

• Wearable devices and medical electronics
• IoT modules and smart sensor hubs
• Automotive ADAS and telematics solutions
• 5G and wireless communication products
• Consumer electronics and smart home devices