KARVIINTERCONNECTS

Integrated Performance in a Compact Footprint

Multi-Chip Module (MCM) design integrates multiple ICs within a single package or substrate, allowing them to operate together as a unified system. MCMs reduce PCB area, minimize interconnect latency, and improve overall speed, power efficiency, and signal integrity — compared to using separate, individually packaged ICs.

Die Placement & Interconnect Design

• Optimized placement of logic, memory, analog, and RF dies
• High-density routing on organic substrates or interposers
• Integration of RDL and TSV for vertical connectivity
• Robust power/ground delivery network design

Substrate & Package Architecture

• Multi-layer substrate design and material optimization
• Thermal solutions using heat spreaders and thermal vias
• SI/PI simulations for high-speed signal paths
• Mechanical warpage and stress reliability analysis

Co-Design & Validation

• Co-design across IC, substrate, and PCB levels
• Design for manufacturability (DFM) and testability (DFT)
• Collaboration with OSAT and foundry partners
• Prototype development and validation testing

Typical Applications

• High-performance computing and AI accelerators
• Wireless and 5G communication modules
• Automotive ADAS and safety systems
• Industrial control and automation devices
• Medical imaging and diagnostic electronics