KARVIINTERCONNECTS

At KARVI INTERCONNECTS, we offer advanced design analysis services to ensure your PCB performs flawlessly under real-world conditions. By integrating Power, Signal, Thermal, and EMI analysis early in the design phase, we help you reduce risks, avoid costly redesigns, and deliver robust, production-ready electronics.

Power Integrity (PI) Analysis

A stable power delivery network (PDN) is essential for high-speed digital and analog systems. Our PI analysis ensures:

• Low impedance PDN across frequency ranges
• Minimal voltage fluctuations and IR drops
• Optimal decoupling capacitor placement
• Power plane resonance avoidance
• Improved regulator-to-load efficiency
• Tools used: Cadence Sigrity, ANSYS SIwave

Signal Integrity (SI) Analysis

For high-speed interfaces like DDR, PCIe, USB, and SERDES, we ensure clean signal transmission by:

• Identifying crosstalk, reflections, overshoot/undershoot
• Matching trace impedance and delay
• Optimizing differential pair routing
• Evaluating via stubs and signal loss
• Ensuring compliance with timing budgets
• Tools used: HyperLynx SI, Sigrity, ADS

Thermal Analysis

• Heat map simulation of PCB and components
• Thermal via and copper pour optimization
• Enclosure and heatsink modeling
• Forced and natural convection design
• Power dissipation and airflow simulation
• Tools used: ANSYS Icepak, FloTHERM, SolidWorks Thermal

EMI/EMC Analysis

Compliance with electromagnetic emission standards is critical. We ensure EMI/EMC control through:

• Identification of radiated and conducted emissions
• Grounding and shielding strategies
• Return path optimization
• Filter and ferrite bead placement
• Compliance with FCC, CISPR, and MIL-STD
• Tools used: EMPro, CST Studio Suite, SIwave

Why Our Analysis Services Matter

• Reduce prototype failures and field returns
• Early detection of design issues
• Fewer design iterations
• Faster time to market
• Meet compliance and certification standards